Indium-Bonden Sputter-Target auf Trägerplatte

Order Indium bonding on a copper (Cu) backing plate service together with custom-made sputtering targets to get ready-to-use turn key solutions.

• To provide a complete solution, oxygen-free copper backing plate and Indium bonding services are available for each sputtering target offered by Polymet
• Standard 1/8" thick (3.175mm) and 2mm thick oxygen-free high conductivity (OFHC) Cu backing plate are available. Other thickness or size and designs are also available upon request.
• Indium is the preferred method for bonding sputtering targets because it has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target
• Indium is also more malleable than other bonding solders and therefore it is more forgiving. The softer solder allows some "give" when the target expands at a different rate than the backing plate. This reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate
• The main limitation of the indium bond is the melting temperature of the indium solder. Indium has a melting point of 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions